Assembly Technology

• Wafer Sawing for Si and SiC die
• Pb and Pb-free Vacuum D/A Soldering
• Pressure and Pressure-less Ag-Sintering
• Multi-Die and Stack-Assy options
• SMT Assembly integration
• Heavy Aluminum, Cu-core-Al and Copper Wirebonding
• Ultrasonic Terminal Welding
• Standard and High CTI Plastic Housing
• High Tg and High CTI Mold Compound
• Standard and Press-fit-pin terminals
• Cu Baseplate with Pin-fin option
• Static Test (Room Temp/Hot Temp)

Certification

• ISO 14001, IATF 16949