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CREATING THE FUTURE NOW: Wide-BandGap assembly partner

Power Discrete

Assembly and test services for standard TO packages, and supports development for enhanced and custom packages

Upcoming new packages:
TO247-4L High Creepage

Power Modules

Design & Development, proto-type, assembly and test services for standard and customize power module platforms for industrial and automotive applications

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Upcoming new packages:
SOT227, 62mm, e-dual, and 3p-Inverters

Services

3D Printing

Design Verification

Die Sales

White Paper

Rapidly Moving Market of Semiconductor Packaging.

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